Pyrex Wafers

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Pyrex Wafers

Corning PYREX® 7740 Wafer is a high-precision borosilicate glass substrate, ideal for anodic bonding, MEMS packaging, microfluidics, and semiconductor WLP. It features a CTE matched to silicon, excellent chemical & thermal stability, high optical transmission, and tight dimensional control. We supply standard 2"~12" wafers (SSP/DSP) from prototype to high-volume production.

Basic materials characteristics

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Pyrex wafers process capability

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The possible applications

  1. Semiconductor applications

  2. Micro lithography

  3. Substrates for anodic bonding

  4. Optical substrates

  5. Micro system technology

  6. Micro mechanics

  7. Microstructure applications