Pyrex Wafers
Corning PYREX® 7740 Wafer is a high-precision borosilicate glass substrate, ideal for anodic bonding, MEMS packaging, microfluidics, and semiconductor WLP. It features a CTE matched to silicon, excellent chemical & thermal stability, high optical transmission, and tight dimensional control. We supply standard 2"~12" wafers (SSP/DSP) from prototype to high-volume production.
Basic materials characteristics
Pyrex wafers process capability
The possible applications
Semiconductor applications
Micro lithography
Substrates for anodic bonding
Optical substrates
Micro system technology
Micro mechanics
Microstructure applications